EDB8164B3PH-8D-F

Contact Sales

Orderable parts

EDB8164B3PH-8D-F-D
EDB8164B3PH-8D-F-R

Specs

  • Chipset Validation
    N/A
  • Cycle Time
    2.5ns
  • Data Rate
    LPDDR2-800
  • Density
    8Gb
  • FBGA Code
    N/A
  • Op. Temp.
    -30C to +85C
  • Part Status
    Obsolete
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Technology
    LPDDR2
  • Width
    x64
  • Chipset Validation
    N/A
  • Cycle Time
    2.5ns
  • Data Rate
    LPDDR2-800
  • Density
    8Gb
  • FBGA Code
    N/A
  • Op. Temp.
    -30C to +85C
  • Part Status
    Obsolete
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Technology
    LPDDR2
  • Width
    x64

Data Sheets

Production Data Sheet: 240-ball 2C0E Mobile LPDDR2 SDRAM

8Gb, PoP, 14mm x 14mm, 240-ball FBGA
  • File Type: PDF
  • Updated: 2014-02-26
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Simulation Models

IBIS: 240-Ball 2C0E DDP Mobile LPDDR2 SDRAM

Rev 1.0
  • File Type: ZIP
  • Updated: 2014-02-28
Download

Technical Notes

TN-00-08: Thermal Applications

This document describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2020-03-25
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TN-46-22: T69M (50nm) to T79M (4xnm) Transition Guide

Transition guide for migration from T69M to T79M
  • File Type: PDF
  • Updated: 2016-06-24
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2020-10-13
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CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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